Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-05-29
1989-02-21
Morgenstern, Norman
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
428689, 428697, B05D 306, B32B 900, B32B 1900
Patent
active
048063843
ABSTRACT:
A method of forming exoergic structures, as well as exoergic structures produced by the method, is provided. The method comprises the steps of passing a plasma-forming gas through a plasma spray gun, forming a plasma spray, introducing exoergic material into the plasma spray and directing the plasma spray toward a substrate, and allowing the exoergic material to become molten, without chemically reacting in the plasma spray and to thereafter impinge on the substrate to form a solid mass of exoergic material, the shape of which corresponds to the shape of the substrate.
REFERENCES:
patent: 2943951 (1960-07-01), Haglund et al.
patent: 3344210 (1967-09-01), Silvia
patent: 3387110 (1968-06-01), Wendler et al.
patent: 3513044 (1970-05-01), Ishibashi
patent: 3523840 (1970-08-01), Bedell
patent: 3591759 (1971-07-01), Stand
patent: 3676638 (1972-07-01), Stand
patent: 3734983 (1973-05-01), Forsten et al.
patent: 3766820 (1973-10-01), Forsten et al.
patent: 4092383 (1978-05-01), Reed, Jr.
patent: 4121083 (1978-10-01), Smyth
patent: 4124663 (1978-11-01), Brumley et al.
patent: 4146654 (1979-03-01), Guyonnet
patent: 4202641 (1980-05-01), Yurasko, Jr.
patent: 4445021 (1984-04-01), Irons et al.
Chafin James H.
Daniel Anne D.
Hightower Judson R.
Morgenstern Norman
Padgett Marianne L.
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