Solventless or high solids-containing silicone pressure sensitiv

Details Solventless or high solids-containing silicone pressure sensitiv Solventless or high solids-containing silicone pressure sensitiv

1991-03-26

1994-03-08

Davis, Jenna L.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

525478, C09J 702, C09J18305, C09J18307

Patent

active

052925862

ABSTRACT:
Solventless or low solvent-containing silicone pressure sensitive adhesive compositions having excellent adhesive strength and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units; (B) a vinyi-endblocked polydiorganosiloxane having a viscosity of 10 to 500 centipoise at 250.degree. C.; (C) a hydride-endblocked polydiorganosiloxane having a viscosity of 10 to 1,000 centipoise at 250.degree. C.; the ratio of silicon-bonded hydrogen atoms in (C) to olefinically unsaturated radicals in the total of (A) and (B), being in the range of from about 1.2:1 to about 15.0:1; and (D) a hydrosilation catalyst.

REFERENCES:
patent: 3983298 (1976-09-01), Hahn et al.
patent: 4774297 (1988-09-01), Murakami et al.
patent: 4988779 (1991-01-01), Medford et al.

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