Method and apparatus for connecting a ball grid array device to

Details Method and apparatus for connecting a ball grid array device to Method and apparatus for connecting a ball grid array device to

1996-01-31

1999-01-12

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, 3241581, G01R 3102

Patent

active

058595384

ABSTRACT:
A probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The probe assembly comprises a ball grid probe having connectors mounted onto opposite sides of a circuit board. A first BGA header is mounted to one side of the probe while a first BGA socket is mounted to the other side of the probe. The socket is adapted to receive an integrated circuit which is mounted onto a second BGA header. A second BGA socket is mounted to a printed circuit board and is adapted to receive the ball grid probe via the first BGA header. An interconnection device is provided to electrically couple the ball grid probe to a number of test instruments.

REFERENCES:
patent: 5532612 (1996-07-01), Liang
patent: 5537051 (1996-07-01), Jalloul et al.
patent: 5548223 (1996-08-01), Cole et al.
patent: 5570033 (1996-10-01), Staab
patent: 5641297 (1997-06-01), Kozel
patent: 5645433 (1997-07-01), Johnson
Author: AMP Incorporated, Title: Mictor Matched Impedance Connector System, Date: Revised May 1995, pp. 1-2, Catalog 65560.
Author: Method Electronics, Inc., Title: Ball Grid Array Socketing System, Date: not listed, p. 4.

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