Semiconductor device, semiconductor module, and radiating fin

Details Semiconductor device, semiconductor module, and radiating fin Semiconductor device, semiconductor module, and radiating fin

1997-10-27

1998-11-10

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257796, 257706, 257675, 257727, H01L 2328

Patent

active

058348425

ABSTRACT:
A groove (21) is formed on an upper surface of sealing resin (2) in the form of a strip. A device (101) is pressed against a flat surface of a radiating fin (55) by a band plate shaped clamper (61) which is engaged with the groove (21). Due to the engagement of the clamper (61) and the groove (21), movement of the device (101) is limited. Namely, the device (101) is stably fixed to the radiating fin (55). Since the device (101) is fixed to the radiating fin (55) by the clamper (61), no hole for receiving a fastening screw is provided in the sealing resin (2). Therefore, the sealing resin (2) is reduced, whereby miniaturization of the device (101) is implemented. Thus, the device is miniaturized at no sacrifice of radiation efficiency.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 5053852 (1991-10-01), Biswas et al.
patent: 5130888 (1992-07-01), Moore
patent: 5193053 (1993-03-01), Sonobe
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5430331 (1995-07-01), Hamzehdoost et al.
"Power Transistor Heat Sink Clamp Plate", Joy et al, IBM TDM vol. 26, No. 10A Mar. 1984 pp. 5184-5185.

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