Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1977-11-28
1979-01-02
Truhe, J. V.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 16HS, 174 52FP, 29588, 357 72, 357 81, H05K 506
Patent
active
041328566
ABSTRACT:
A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a hermetically sealed bumped die); gang-bonding the die to said leads; preferably testing the die and bounding thereof for electrical performance, continuity, etc.; placing a metal heat sink having a raised die attach area and a pair of pedestals coextensive with said film carrier into a transfer mold with the leads remaining planar; epoxy bonding said die to said die attach area concurrently soldering selected leads to said pedestals; and completely encapsulating said die in plastic while in said mold allowing said plastic to flow freely on both sides of the die attach area and over most of said heat sink to prevent warpage of the package when said plastic and metal cools but leaving the outer edges of said leads, not connected to said pedestals, open and free of plastic.
In one embodiment, a leadless type package is formed by the process with the heat sink having means for liquid or change of state cooling, and in another embodiment an air cooled leadless type package is formed by the process.
REFERENCES:
patent: 3484534 (1969-12-01), Kilby et al.
patent: 3611061 (1971-10-01), Segerson
patent: 3689683 (1972-09-01), Paletto et al.
patent: 3922712 (1975-11-01), Stryker
patent: 3930114 (1975-12-01), Hodge
patent: 4007479 (1977-02-01), Kowalski
Hutchison Robert V.
Nelson John A.
Burroughs Corporation
Dwyer Joseph R.
Peterson Kevin R.
Tone D. A.
Truhe J. V.
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