Enclosing a small-format electrical device

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156 731, 156292, 1563096, 264445, B32B 3116

Patent

active

058337857

ABSTRACT:
An injection molded plastic housing for, and method of enclosing, an electrical device including placing the device between a housing including a lid member and a base member and joining the lid member and the base member to each other and to a connector attached to the enclosed device. The lid member, base member and connector each may include a means for mating to promote their joining to form an assembled plastic housing with increased structural integrity. The lid member and base member join with the connector in a substantially overlapping relationship that results in a rigid and aesthetically pleasing housing which complies with standards for PC card style devices set by, for example, CFA, PCMCIA, JEDIC, ISO, etc. The inexpensive injection molded plastic material of the housing and the limited number of parts provides for an easily automated, economical method of enclosing electrical devices for use, for example, in computer peripheral and memory applications.

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Photographs (4) of an enclosure for a PC card constructed in accordance with standards set by JEDIC and known to applicant to have been in public use more than one year prior to Aug. 12, 1996, the filing date of this application.

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