Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-02-24
1999-09-14
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257778, H01L 2348
Patent
active
059527188
ABSTRACT:
A semiconductor device having a protection layer covering the active layer of a semiconductor chip with an opening therein corresponding in location to a chip electrode located on the active surface of the semiconductor chip. Inside the opening a barrier layer covers the chip electrode, a diffusion barrier layer covers the barrier layer and a protruding contact protruding from the diffusion barrier layer. The protruding contact preferably comprises material whose hardness is lower than that of each of the barrier layer and chip electrode.
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Fujimoto Hiroaki
Kawakita Tetsuo
Matsumura Kazuhiko
Ohtsuka Takashi
Brown Peter Toby
Matsushita Electric - Industrial Co., Ltd.
Potter Roy
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