Semiconductor devices having protruding contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257778, H01L 2348

Patent

active

059527188

ABSTRACT:
A semiconductor device having a protection layer covering the active layer of a semiconductor chip with an opening therein corresponding in location to a chip electrode located on the active surface of the semiconductor chip. Inside the opening a barrier layer covers the chip electrode, a diffusion barrier layer covers the barrier layer and a protruding contact protruding from the diffusion barrier layer. The protruding contact preferably comprises material whose hardness is lower than that of each of the barrier layer and chip electrode.

REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5471092 (1995-11-01), Chan et al.
patent: 5634268 (1997-06-01), Dalal et al.
patent: 5665996 (1997-09-01), Williams et al.
Patent Abstracts of Japan, vol. 006, No. 160 (E-126), Aug. 21, 1982 & JP 57 079649 A (Seiko Epson Corp), May 18, 1982, *abstract*.
Proceedings of the Electronic Components and Technology Conference, Orlando, Jun. 1-4, 1993, No. conf. 43, Jun. 1, 1993, Institute of Electrical and electronics Engineers, pp. 579-583, XP000380056 Howell W J Et Al: "Area Array Interconnection With CU-PI Thin Films on a Multi-Layer Glass-Ceramic Substrate" *p. 581, right-hand column, last paragraph--p. 582, left-hand column, last paragraph; figure 8*.
Research Disclosure, No. 330, Oct. 1, 1991, p. 778 XP000265038 "Chip Pad Process" *the whole document*.
Patent Abstracts of Japan; vol. 096, No. 010, Oct. 31, 1996 & JP 08 148495 A (Fujitsu Ltd), Jun. 7, 1996 *abstract*.
Patent Abstracts of Japan;, vol. 095, No. 008, Sep. 29, 1995 & JP 07 122591 A (Nippondenso Co Ltd), May 12, 1995 *abstract*.
"Encapsulated Solder Joint For Chip Mounting"; IBM Technical Disclosure Bulletin; vol. 32, No. 108, Mar. 1, 1990, p. 480 XP000097966; *the whole document*.
Patent Abstracts of Japan; vol. 095, No. 006; Jul. 31, 1995 & JP 07 078848 A (Nippondenso Co Ltd); Mar. 20, 1995; *abstract*.
Patent Abstracts of Japan; vol. 012, No. 414 (E-677); Nov. 2, 1988 & JP 63 152136 A (Fuji Electric Co Ltd); Jun. 24, 1988; *abstract.
Patent Abstracts of Japan; vol. 008, No. 200 (E-266), Sep. 13, 1984 & JP 59 088861 A (Matsushita Denki Sangyo KK); May 22, 1984; *abstract*.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor devices having protruding contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor devices having protruding contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor devices having protruding contacts will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1512553

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.