Packaged semiconductor device and method of manufacturing the sa

Details Packaged semiconductor device and method of manufacturing the sa Packaged semiconductor device and method of manufacturing the sa

1997-07-16

1999-09-14

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257686, 257774, 257777, H01L 2302

Patent

active

059527129

ABSTRACT:
A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on a surface of the package opposite to a surface thereof which is bonded to the LSI chip, so as to be connected to the electrode of the board, at least one through hole formed to extend through the LSI chip and the package, and a connecting conductor formed to extend through the through hole in order to connect the electrode of the package and the electrode of the LSI package to each other.

REFERENCES:
patent: 3560257 (1971-02-01), Schneble, Jr. et al.
patent: 4499655 (1985-02-01), Anthony
patent: 4733291 (1988-03-01), Levy et al.
patent: 4991090 (1991-02-01), Bone et al.
patent: 5065228 (1991-11-01), Foster et al.
patent: 5198695 (1993-03-01), Hanes et al.
patent: 5229647 (1993-07-01), Anadinger
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5386142 (1995-01-01), Kurtz et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5404044 (1995-04-01), Booth et al.
patent: 5406125 (1995-04-01), Johnson et al.
patent: 5530288 (1996-06-01), Stone
patent: 5552633 (1996-09-01), Sharma
patent: 5825080 (1998-10-01), Imaoka et al.
Linder S. et al. "Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers" Proceeding of the workshop on micro electro mechanical systems (MEM, OISO, Jan. 25-28, 1994) No. Workshop 7.25 Jan. 1994, pp. 349-354, XP000528439, Institute of electrical and electronics engineers.

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