Method of and apparatus for evaluating reliability of metal inte

Details Method of and apparatus for evaluating reliability of metal inte Method of and apparatus for evaluating reliability of metal inte

1994-10-27

1996-07-02

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324717, 324719, 324765, G01R 3126, G01R 2708

Patent

active

055326005

ABSTRACT:
Disclosed is a method of and an apparatus for evaluating the reliability of metal interconnects. It is capable of performing the evaluation under such a testing condition as to reproduce an actual operating environment, that is, under the testing condition of simultaneously accelerating electromigration and stress-induced migration, thereby evaluating failures conventionally missed to be evaluated. In particular, this method is applicable for evaluating the reliability of metal interconnects of semiconductor devices, and which includes the steps of performing a constant-temperature storage test I for interconnect reliability evaluation at a temperature over a specified temperature for a specified time; and applying a current to the interconnect and simultaneously performing a test II of measuring a voltage of the interconnect.

REFERENCES:
patent: 3676775 (1972-07-01), Dupnock et al.
patent: 4520448 (1985-05-01), Tremintin
patent: 4945302 (1990-07-01), Janum
patent: 5057441 (1991-10-01), Gutt et al.
patent: 5239270 (1993-08-01), Desbiens
patent: 5260668 (1993-11-01), Mallory et al.

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