Ingot trimming method and apparatus

Details Ingot trimming method and apparatus Ingot trimming method and apparatus

1997-08-22

1998-11-10

Rose, Robert A.

Stone working

Sawing

Rotary

125 1106, 8352219, 83421, 33562, 33628, B28D 104

Patent

active

058329145

ABSTRACT:
An apparatus for cutting a semiconductor ingot utilizing an inner-diameter saw. The apparatus includes a reference structure positioned on the saw at a predetermined distance from the saw blade and a template having a cut positioning portion and a reference portion separated from the cut positioning portion by a distance corresponding to the predetermined distance. The template is adapted to be placed on the ingot with the cut positioning portion disposed adjacent the desired cut location so that the reference portion establishes a reference position on the ingot. The saw is adapted thereby to cut the ingot at the desired location when the reference position on the ingot is aligned with the reference structure on the saw.

REFERENCES:
patent: 509764 (1893-11-01), Preece
patent: 2852049 (1958-09-01), Peterson
patent: 5025593 (1991-06-01), Kawaguchi et al.
patent: 5226403 (1993-07-01), Toyama
patent: 5413521 (1995-05-01), Terashima et al.

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