Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-08-12
1996-10-01
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257686, 257712, 257723, 361712, 361715, 4395401, H05K 720
Patent
active
055615910
ABSTRACT:
An electrically and thermally conductive rail assembly with impedance control for interconnecting individual level-one integrated circuit packages within a three-dimensional high density integrated circuit package, and methods of manufacturing same.
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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870.
"High Density Memory Packaging Technology High Speed Imaging Applications," Dean Frew, Texas Instruments Inc., SPIE vol. 1346 Ultrahigh- and High-Speed Photography, Photonics, and Velocimetry '90, pp. 200-209.
"Vertically-Integrated Package," Abstract, Alvin Weinberg, W. Kinzy Jones, IEEE , pp. 436-443. No known date.
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE , pp. 540-547. No known date.
Staktek Corporation
Thompson Gregory D.
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