Process for manufacturing bumped tab tape

Fishing – trapping – and vermin destroying

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Details

437183, 437220, 22818022, H01L 2148, H01L 2171

Patent

active

055321860

ABSTRACT:
A manufacturing method for a TAB tape which forms a plurality of bumps on a plurality of sheet-like leads of the TAB tape. First, the leads are fixed to a belt-shaped tape member having a plurality of first openings arranged at equal intervals in a longitudinal direction and a plurality of second openings formed around each of the first openings. In fixing each lead to the tape member, one end portion of the lead is exposed to each first opening, and the other end portion of the lead is exposed to each second opening. Secondly, a point is pressed onto a surface of each lead to form a plurality of recesses on the surface of each lead. Thirdly, a metal ball is seated in each recess, and is then heated to be molten so that a part of the metal ball may substantially semispherically project from the surface of the lead. Thus, a metal bump is formed as a substantially semispherical part projecting from the surface of each lead. Instead of the use of the metal ball, a mixture of a metal powder and a paste may be filled in each recess. In this case, the mixture filled in each recess is heated to be molten so that a part of the mixture may substantially semispherically project from the surface of each lead, thus forming the metal bumps on the surface of each lead.

REFERENCES:
patent: 3134935 (1964-05-01), Parsons et al.
patent: 4396457 (1983-08-01), Bakermans
patent: 4916516 (1990-04-01), Miles et al.
patent: 5123163 (1992-06-01), Ishikawa et al.
patent: 5132772 (1992-07-01), Fetty
Microelectronics Packaging Handbook, New York, Van Nostrand Rewhold, 1989. pp. 374, 409-426, and 828-829. TK7874.T824 1988.

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