Method of making multiple-bond shelf plastic package

Details Method of making multiple-bond shelf plastic package Method of making multiple-bond shelf plastic package

1996-12-31

1998-11-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 427 96, 427 97, H05K 336

Patent

active

058325964

ABSTRACT:
A method for forming a package for an integrated circuit in which a plurality of conduction paths are formed on a first board and on a second board. Holes are formed in the first board and the second board wherein the holes are adapted for receiving pins. The holes are aligned and the first board is coupled to the second board using an adhesive.

REFERENCES:
patent: 3516156 (1970-06-01), Steranko
patent: 4644643 (1987-02-01), Sudo
patent: 4668332 (1987-05-01), Ohnuki et al.
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5051216 (1991-09-01), Madou et al.

Affiliated with

Also associated with

Rating

Method of making multiple-bond shelf plastic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making multiple-bond shelf plastic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making multiple-bond shelf plastic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1504891