Power substrate with improved thermal characteristics

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174254, 174260, 361761, H05K 102

Patent

active

056419449

ABSTRACT:
A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs. The layers are advantageously thermally matched such that heat generated during operation is evenly dissipated by the mounting area and causes uniform expansion of all layers.

REFERENCES:
patent: 3760090 (1973-09-01), Fowler
patent: 4539622 (1985-09-01), Akasaki
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4861272 (1989-08-01), Clark
patent: 5041899 (1991-08-01), Oku et al.
patent: 5045642 (1991-09-01), Ohta et al.
patent: 5306874 (1994-04-01), Biron

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Power substrate with improved thermal characteristics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power substrate with improved thermal characteristics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power substrate with improved thermal characteristics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-150430

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.