Abrading – Abrading process – Glass or stone abrading
Patent
1997-01-28
1999-09-14
Rose, Robert A.
Abrading
Abrading process
Glass or stone abrading
451 57, 451 58, 451288, B24B 100
Patent
active
059513748
ABSTRACT:
A method of polishing semiconductor wafers includes a double side primary polishing step and a single side secondary polishing step using a single side polishing machine with a wafer holder including a template so bonded on a carrier plate as having one or more wafer receiving holes in which backing pads are disposed respectively for holding the back sides of the respective wafers fittingly received therein. This method makes it to possible to hold a plurality of wafers at one time due to batch processing to thereby improve the productivity, and decrease extremely the generation of the defective dimples in the front side of the wafer. Compared with conventional single side polishing, the flatness level of the wafer polished with the double side polishing machine in this method is improved.
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Kato Tadahiro
Kudo Hideo
Masumura Hisashi
Nakano Masami
Nguyen George
Rose Robert A.
Shin-Etsu Handotai & Co., Ltd.
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