Techniques for mounting semiconductor dies in die-receiving area

Details Techniques for mounting semiconductor dies in die-receiving area Techniques for mounting semiconductor dies in die-receiving area

1995-03-27

1996-10-01

Fourson, George

Fishing, trapping, and vermin destroying

437209, 437214, 437215, 437219, 257666, 257670, 257676, 257730, 257773, 257784, H01L 2148

Patent

active

055610862

ABSTRACT:
In cases where there are at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a die-receiving area, one or more bond wire support structure are disposed in the gap, thereby causing a long bond wire to behave as two or more shorter bond wires. The bond wires are tacked to a top surface of the support structure by various alternative means. Alternatively, a "jumper" structure having conductive traces of graduated length can be disposed in the die-receiving area between the die and the edges of the die-receiving area, providing an intermediate connection between the die and the leads of the package, thereby permitting short bond wires to be used in lieu of long bond wires.

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