Method for producing a metal film resistor

Details Method for producing a metal film resistor Method for producing a metal film resistor

1994-12-15

1996-10-01

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205224, 205239, C25D 358, C23C 2802

Patent

active

055608124

ABSTRACT:
A method for producing a metal film resistor including at least an insulating substrate, a resistor film of copper-nickel alloy formed on the surface of the insulating substrate, and a pair of terminals which are in contact with the resistor film is provided. The method includes a step of depositing the copper-nickel alloy by electroplating from an aqueous pyrophosphate bath containing a copper salt and a nickel salt at a bath temperature of 20.degree.-40.degree. C. and a pH of 6-8.

REFERENCES:
patent: 3833481 (1974-09-01), Olson et al.
patent: 4454495 (1984-06-01), Werner et al.
Abner Brennet, Electrodeposition of Alloys, Principles and Practice, Academic Press, New York, 1963, vol. I, pp. 558-566.
Ishikawa et al., "Copper-Nickel Alloy Deposition From Pyrophosphate Bath Containing Thioglycolic Acid", 1980, pp. 35-39.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 374-377, 416-423.

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