Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1995-08-14

1996-10-01

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Cellulose liberation waste liquor, solid, or reaction...

106 126, C23C 1852

Patent

active

055607640

ABSTRACT:
The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of prated areas. The electroless gold plating solution according to the invention contains 2-20 g/l of dimethylamine as amine group.

REFERENCES:
patent: 3700469 (1972-10-01), Okinaka
patent: 4307136 (1981-12-01), Prost-Tournier et al.
patent: 4337091 (1982-06-01), El-Shazly et al.
patent: 4792469 (1988-12-01), Saito et al.
patent: 4978559 (1990-12-01), Iacovangelo
patent: 4985076 (1991-01-01), Iacovangelo
patent: 5035744 (1991-07-01), Nishiyama et al.
patent: 5292361 (1994-03-01), Otsuka et al.
Communication dated Nov. 28, 1995 in EP95305654.6 (1 page).
European Search Report, Nov. 21, 1995, for EP95305654 (1 page).

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