Method of making solder shape array package

Details Method of making solder shape array package Method of making solder shape array package

1994-12-30

1996-07-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 22818021, 22818022, 439 66, 439 67, H01K 310

Patent

active

055310214

ABSTRACT:
A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solder structure site. An integrated circuit is bonded to the top surface of the substrate using a conventional tape automated bonding (TAB) process or other suitable bonding process. The preferred shape of the solder structure is a cone, but other shapes, including hemispheres, columns and pyramids can be produced using a mold with suitably shaped cavities. The mold is preferably as large as an entire substrate panel so that a large number of device sites can be processed simultaneously.

REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 5155905 (1992-10-01), Miller, Jr.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5244143 (1993-09-01), Ference et al.

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