Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-05-21
1999-09-14
Hughes, S. Thomas
Metal working
Method of mechanical manufacture
Electrical device making
29832, 29840, H05K 1304, H05K 330
Patent
active
059503041
ABSTRACT:
A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.
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DiStefano Thomas H.
Khandros Igor Y.
Hughes S. Thomas
Tessera Inc.
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