Method for selective surface treatment of semiconductor structur

Details Method for selective surface treatment of semiconductor structur Method for selective surface treatment of semiconductor structur

1987-07-20

1988-12-06

Ozaki, George T.

Fishing, trapping, and vermin destroying

437225, 437229, 156662, 430 84, 430270, H01L 2138, H01L 2147

Patent

active

047896469

ABSTRACT:
Surface features of a semiconductor structure above a predetermined level are exposed for selective treatment (e.g., etching) by forming a layer of a solvent-expanded polymer on the surface of the structure, and allowing the layer to dry and cure, thereby relaxing to the predetermined level, at which it protects the underlying structure during treatment. Subsequently, the protective layer is removed by rinsing in a solvent.

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