Pulse electroplating process

Details Pulse electroplating process Pulse electroplating process

1986-07-11

1988-12-06

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 47, 204DIG9, C25D 104, C25D 350

Patent

active

047894377

ABSTRACT:
A process is provided for obtaining crack-free deposits of rhodium by a pulse electroplating process.

REFERENCES:
patent: 2895889 (1959-07-01), Schumpelt
patent: 3775267 (1973-11-01), Yahalom
J. Cl. Puippe et al., Plating and Surface Finishing, pp. 68-72, Jun. 1980.
V. A. Lamb, Plating, pp. 909-913, Aug. 1969.
"Morphology and Crystallographic Features of Silver Deposits in the Pulsed Current Electrolysis," T. Hayashi, et al., AES Second International Pulse Plating Symposium, Oct. 1981, No. 26, p. 1; Paragraphs 1 and 4; No. 54, p. 1-2; No. 75, Table 2.
"Pulse-Plated Deposits of Gold and Rhenium," K. Hosokawa, et al., Plating and Surface Finishing, Oct. 1980, pp. 52-56.
"To Pulse . . . or Not to Pulse," M. Murphy, Metal Finishing, Jun., 1979, p. 7.
"Influence of Pulse Parameters On Properties of Deposits," J. Cl. Puippe, et al., Amer. Electroplaters' Society, 4/19-4/20, 1979.
"Rhodium--Electrodeposition and Applications," M. Pushpavanam, et al., Surface Technology, vol. 12 (1981), pp. 351-360.

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