Method of alignment between mask pattern and wafer pattern

Details Method of alignment between mask pattern and wafer pattern Method of alignment between mask pattern and wafer pattern

1998-08-04

2000-07-04

Font, Frank G.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

356363, 250548, 2505593, 355 53, 430 30, 430 22, G01B 1100

Patent

active

06084678&

ABSTRACT:
A method of aligning a mask pattern and a wafer pattern by referring to alignment marks on chips is provided wherein all of the chips to be used for alignment are classified into a plurality of groups so that the shot array alignment is carried out by referring to the alignment marks which are provided at different positions in individual chips. The alignment marks and chip positions for the alignment marks are different for each of the groups.

REFERENCES:
patent: 4568189 (1986-02-01), Bass et al.
patent: 4991962 (1991-02-01), Jain
patent: 5521036 (1996-05-01), Iwamoto et al.
patent: 5559601 (1996-09-01), Gallatin et al.
patent: 5783342 (1998-07-01), Yamashita et al.
patent: 6018395 (2000-01-01), Mori et al.
S. Slonaker et al., "Enhanced global alignment for production optical lithography", pp. 73-81, Optical/Laser Microlithograph SPIE, vol. 922, 1988.

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