Metallic wiring substrate

Details Metallic wiring substrate Metallic wiring substrate

1995-10-19

1997-07-15

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 257 59, 257 72, 257350, 257761, 257765, 437913, B32B 300, H01L 2904, H01L 2701

Patent

active

056481462

ABSTRACT:
On a metallic wiring substrate, a first metallic layer is connected to a second metallic layer at a non-anodic-oxide section of the first metallic layer exposed at a bottom of a contact hole. The surface of the first metallic layer is anodically oxidized except for the non-anodic-oxide section. After resist is patterned so as to be entirely positioned on the surface of the first metallic layer, the first metallic layer is anodically oxidized, and the resist is removed therefrom. In such a manner, the non-anodic oxide section and the anodic oxide section are formed. This method makes it possible to produce the metallic wiring substrate having good insulation properties between layers easier than a method for forming the non-anodic-oxide section by etching the anodic oxide section.

REFERENCES:
patent: 4433004 (1984-02-01), Yonezawa
patent: 5202274 (1993-04-01), Bae et al.
patent: 5334544 (1994-08-01), Matsuoka
patent: 5359206 (1994-10-01), Yamamoto et al.

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