Mounting apparatus for leadless electronic parts

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Patent

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Details

29840, H05K 332

Patent

active

044519761

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention relates to a mounting apparatus for mounting leadless electronic parts such as chip type resistors and the like onto a printed circuit board.


BACKGROUND OF THE INVENTION

Due to recent developments in the field of leadless electronic parts, a method has been put to practical use in which as shown in FIG. 1, a leadless electronic part 3 is mounted between conductive patterns 2 on a printed circuit board 1 by the use of adhesive 4 and then, is dipped, for soldering thereof, into a tank containing molten solder so that an electrical circuit unit for an electric appliance may be formed.
In conventional mounting apparatuses for leadless electronic parts of this kind, it has been so arranged that leadless electronic parts supplied sequentially from a parts feeder, etc. are transported to their mounting portions of a printed circuit board, while being gripped by a chuck adapted to be opened and closed forcibly by a cylinder. However, the known mounting apparatuses have such inconveniences that they are slow in operations, and have an insufficient mounting accuracy.


DISCLOSURE OF THE INVENTION

Accordingly, the present invention has for its object to provide a mounting apparatus for leadless electronic parts wherein leadless electronic parts supplied through a cylindrical chute are dropped one by one into a part holding hole of a pusher with the part holding hole having a cutout, the pusher transports the leadless electronic part between chucks in response to forward movement of the pusher through pushing thereof, and then a main block including the chucks is pivoted such that the leadless electronic parts are taken out of the pusher and mounted on their mounting portions of a printed circuit board, thus making it possible to effect a reliable and rapid mounting.


BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a leadless electronic part mounted on a printed circuit board,
FIG. 2 is a view explanatory of a basic structure of a mounting apparatus for leadless electronic parts, according to one embodiment of the present invention,
FIG. 3 is a perspective view of a pusher for supplying the leadless electronic parts to the mounting apparatus of FIG. 2,
FIG. 4 is a top plan view of the leadless electronic parts mounted on the printed circuit board in an X-axis and a Y-axis directions thereof,
FIG. 5 is a perspective view of the mounting apparatus of FIG. 2,
FIG. 6 is a cross-sectional view of the mounting apparatus of FIG. 5,
FIG. 7 is an exploded perspective view of a main block of the mounting apparatus of FIG. 5,
FIG. 8 is an exploded perspective view of a chuck body of the mounting apparatus of FIG. 5,
FIG. 9 is a perspective view of a chuck portion of the mounting apparatus of FIG. 5,
FIG. 10 is a perspective view of a stripper portion of the mounting apparatus of FIG. 5,
FIG. 11 is a cross-sectional view of the chuck portion of the mounting apparatus of FIG. 5, and
FIGS. 12A, 12B and 12C are views explanatory of mounting states of the leadless electronic part mounted on the printed circuit board in accordance with deformation of the printed circuit board.


THE BEST PREFERRED EMBODIMENT OF THE PRESENT INVENTION

Firstly, a basic structure of the present invention will be described, hereinbelow.
As shown in FIG. 2, leadless electronic parts 3 supplied in alignment with each other through a cylindrical chute 5 are dropped one by one, into a part holding hole 7 of a part feeding pusher 6 shown in FIG. 3, with the part holding hole 7 having a cutout 7'. Then, the leadless electronic part 3 in the part holding hole 7 is transported, in response to forward movement of the part holding pusher 6 through pushing thereof, between chucks 10 and 11 of a chuck body 9 provided on a main block 8. Thereafter, the main block 8 is pivoted such that the leadless electronic parts 3 are taken out of the part holding hole 7 of the part feeding pusher 6 and are mounted at predetermined positions on a printed circuit board 1, with adhesive 4 being applied to the

REFERENCES:
patent: 4327482 (1982-05-01), Araki et al.
patent: 4393579 (1983-07-01), Van Hooreweder

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