Slot transfer molding apparatus and methods

Details Slot transfer molding apparatus and methods Slot transfer molding apparatus and methods

1982-07-26

1984-07-17

Czaja, Donald E.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

29588, 26427214, 2642971, 425116, 425544, B29F 110

Patent

active

044605374

ABSTRACT:
An improved means and method is provided for encapsulating electronic devices and other objects by transfer molding. The mold cavities are arranged in rows, disposed adjacent to and parallel with slot-shaped encapsulant reservoirs, and coupled to the reservoirs by short feeder channels of uniform length. Preferably, a row of cavities is located in a mirror symmetric fashion on either side of and parallel with each slot-shaped reservoir. A tightly fitting blade moves in each slot-shaped reservoir to compress and liquify the plastic encapsulant charge, injecting it into the mold cavities containing the component to be encapsulated. Plastic utilization can exceed 90%, and better control over molding conditions can be obtained because the plastic material reaches each mold cavity at the same stage of the liquification-solidification cycle. More cavities can be fitted in a given mold area because the usual central material pot and runner-tree are eliminated.

REFERENCES:
patent: 3413713 (1968-12-01), Heida et al.
patent: 3471900 (1969-10-01), Burns
patent: 3530541 (1970-09-01), Burns
patent: 3685784 (1972-08-01), Spanjer
patent: 3793714 (1974-02-01), Bylander
patent: 4347211 (1982-08-01), Bandoh
patent: 4386898 (1983-06-01), Sera
patent: 4388265 (1983-06-01), Bandoh
P. Burggraaf, "Successful Encapsulation: Molds and Presses," Semiconductor International, Dec. '80, pp. 29-44.

Affiliated with

Also associated with

Rating

Slot transfer molding apparatus and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slot transfer molding apparatus and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slot transfer molding apparatus and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1490263