Semiconductor device manufacturing: process – With measuring or testing
Patent
1996-01-16
1997-06-24
Picardat, Kevin
Semiconductor device manufacturing: process
With measuring or testing
438464, 438977, H01L 21302
Patent
active
056417144
ABSTRACT:
According to the present invention, a method of manufacturing members, with a plurality of members being formed together on a single substrate and the substrate being cut in such a manner as to be divided into individual members after a characteristic evaluation of the members is carried out, comprises the steps of, carrying out the evaluation of the characteristics and applying ink marks of a prescribed height to surfaces of members deemed to have been defective, affixing a protective tape having an adhesive layer of a thickness equal to or greater than the height of the ink marks, to the surface of the substrate and cutting the substrate in such a manner as to be divided into individual members after a lower surface of the substrate has been ground or polished.
REFERENCES:
patent: 5270260 (1993-12-01), Scheuenpflug
patent: 5362681 (1994-11-01), Roberts, Sr. et al.
Picardat Kevin
Sony Corporation
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