Epoxy resin composition and semiconductor device

Details Epoxy resin composition and semiconductor device Epoxy resin composition and semiconductor device

1997-12-18

2000-07-04

Dawson, Robert

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

523443, 523453, 523456, 524 86, 524251, 528 90, 528 94, 528109, 528114, 528374, C08F28310

Patent

active

060840374

ABSTRACT:
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

REFERENCES:
patent: 4981728 (1991-01-01), Homma et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 5336703 (1994-08-01), Homma et al.
patent: 5798400 (1998-08-01), Tokunaga et al.
patent: 5854316 (1998-12-01), Shimizu et al.
English Abstract for JP-B 18853/1994.
English Abstract for JP-A 103525/1983.
English Abstract for JP-A 76420/1983.
English Abstract for JP-A 100128/1982.

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