Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-05-20
1988-12-06
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29852, 156252, B32B 310, B32B 3100
Patent
active
047887664
ABSTRACT:
A method of fabricating a multilayer circuit board assembly capable of operating at microwave frequencies. Specifically, multilayer circuits such as complex beam forming networks and antennas having internal via holes may be fabricated in a single bonding cycle. This is accomplished by first preparing individual circuit boards (10) by pre-forming holes (18) through circuitry (14,16) etched on opposite sides of a substrate (12). The holes (18) are next selectively plated with a conductive layer (20) and then with a material (24) capable of forming a melted fusion bond and/or a solid-state fusion bond. Bonding film (56) is placed between each board-to-board interface of a multi-board assembly and the assembly of boards is subjected to a bonding cycle of heat and pressure wherein an integral unit is effected.
REFERENCES:
patent: 4338136 (1983-06-01), Huie et al.
patent: 4663208 (1987-05-01), Ninomiya et al.
Burger Henry A.
White Harold E.
Germain L. A.
Hall Carl E.
Loral Corporation
Milliken P. E.
Ross Taylor J.
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