Methods of forming flip chip bumps and related flip chip bump co

Details Methods of forming flip chip bumps and related flip chip bump co Methods of forming flip chip bumps and related flip chip bump co

1997-09-16

2000-07-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 438107, 438613, H01L 2144, H01L 2148, H01L 2150

Patent

active

06083773&

ABSTRACT:
Methods of forming flip chip bumps and related flip chip bump constructions are described. In one implementation, a bump of conductive material is formed over a substrate. At least a portion of the bump is dipped into a volume of conductive flowable material, with some of the flowable material remaining over the bump. The remaining flowable material over the bump is solidified and includes an outermost surface the entirety of which is outwardly exposed. In another implementation, the outermost surface include an uppermost generally planar surface away from the substrate. The solidified flowable material together with the conductive material of the bump provide a bump assembly having a height which is greater than the height of the original bump. The increased height is achieved without meaningfully increasing a width dimension of the bump proximate the substrate.

REFERENCES:
patent: 2934685 (1960-04-01), Jones
patent: 4600600 (1986-07-01), Pammer et al.
patent: 5022580 (1991-06-01), Pedder
patent: 5541135 (1996-07-01), Pfeifer et al.
patent: 5760469 (1998-06-01), Higashiguchi et al.
patent: 5796591 (1998-08-01), Dalal et al.
patent: 5828128 (1998-10-01), Higashiguchi et al.
Ken Gilleo, "Flip or Flop?", Technical Articles of Alpha Metals, Inc., Dec. 1996.
Ken Gilleo et al., "Flip Chip 1, 2, 3: Bump, Bond, Fill", Alpha Metals, Inc., Jul. 1996.
"Encapsulated Solder Joint for Chip Mounting"; IBM Technical Disclosure Bulletin, vol. 32, No. 10B, Mar. 1990; 1 page.

Affiliated with

Also associated with

Rating

Methods of forming flip chip bumps and related flip chip bump co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of forming flip chip bumps and related flip chip bump co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming flip chip bumps and related flip chip bump co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1485505