Method of reducing carbon incorporation into films produced by c

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427535, 427533, 4272557, C23C 1656, H05H 100

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active

060835680

ABSTRACT:
In one aspect, a deposition method comprises the following steps: a) forming a layer on a semiconductive substrate, the layer comprising predominately an inorganic material, the layer also comprising incorporated carbon; b) generating a plasma adjacent the layer from a component gas, the component gas comprising Ar, and c) utilizing the plasma to remove the carbon from the layer.

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