Method to make an integrated circuit with severable conductive s

Details Method to make an integrated circuit with severable conductive s Method to make an integrated circuit with severable conductive s

1979-01-04

1981-05-19

Dean, R.

Metal working

Method of mechanical manufacture

Assembling or joining

29584, 29590, 29591, 148187, 357 51, 357 59, 357 68, 357 71, H01L 2128, H01L 2348

Patent

active

042676339

ABSTRACT:
To render severing of electrical conductors on integrated circuit (IC) chips more reliable, the region of insulating material, typically silicon oxide, beneath the zone which is to be severed, is increased in thickness; the increase in thickness is, preferably, in stepped form, so that the heat capacity at the point of severing of the conductor is less than the heat dissipation at other regions of the conductor, and especially at the point of application of the current probes. Preferably, the contact points at which the current probes are applied are located directly on the semiconductor surface without any intervening insulating oxide layer.

REFERENCES:
patent: 3484341 (1969-12-01), Devitt
patent: 3553830 (1971-01-01), Jenny et al.
patent: 3564354 (1971-02-01), Aoki et al.
patent: 3699395 (1972-10-01), Boleky
patent: 3778886 (1973-12-01), Shields et al.
patent: 3792319 (1974-02-01), Tsang
patent: 3930304 (1976-01-01), Keller et al.
Warner et al., Integrated Circuits, Textbook, McGraw-Hill, 1965, p. 134.

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