Corrosive resistant semiconductor interconnect pad

Details Corrosive resistant semiconductor interconnect pad Corrosive resistant semiconductor interconnect pad

1974-08-21

1977-01-25

Wojciechowicz, Edward J.

357 54, 357 59, 357 72, H01L 2934, H01L 2904, H01L 2348, H01L 2328

Patent

active

040054551

ABSTRACT:
An interconnect pad for electrical coupling between a semiconductor integrated circuit and external leads or the like which includes a secondary conductive path in the event of degradation of the interconnect pad. Metallic contact and conductive elements in the integrated circuit are separated from, and otherwise protected from, deliquescent chemical radicals such as P.sub.2 O.sub.5 contained in underlying structure of the integrated circuit by a layer of silicon.

REFERENCES:
patent: 3760202 (1973-09-01), Kosonocky
patent: 3761327 (1973-09-01), Harlow et al.
patent: 3881971 (1975-05-01), Greer et al.

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