Method of packaging an electronic device using a common holder t

Details Method of packaging an electronic device using a common holder t Method of packaging an electronic device using a common holder t

1990-08-24

1992-03-17

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437207, 437925, 118728, 20419225, H01L 2130, H01L 2156, H01L 2158, H01L 2160

Patent

active

050968513

ABSTRACT:
An improved electric device and manufacturing method for the same are described. The device is for example an IC chip clothed in moulding. In advance of the moulding process, the IC chip is coated with silicon nitride in order to protect the IC chip from moisture invaded through cracks or gaps. The coating of silicon nitride is carried out by plasma CVD. Particularly, an AC voltage is applied to the IC chip during deposition for the purpose of obtaining an excellent property of the silicon nitride coating.

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Wolf, S, and Tauber, R. N. Silicon Processing for the VLSI Era, CA., Lattice Press, 1986, pp. 349 and 358, TK 7874,W6 1986.

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