Manufacturing printed wiring boards having electromagnetic wave

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29830, 156901, 156902, 174255, 174256, 428901, H05K 302

Patent

active

052916537

ABSTRACT:
A method of manufacturing a printed wiring board comprises providing a substrate and forming a printed circuit having a ground circuit on the substrate. An insulating layer is formed on the substrate over the printed circuit and consists of two successively formed insulating layers having concentric circular apertures defining an opening above the ground circuit. The opening has a circular, stepped shape effective to facilitate the subsequent formation of an electromagnetic wave shielding layer. An electromagnetic wave shielding layer is formed by silk screening a conductive paste on the substrate over the insulating layer and through the opening and over the ground circuit.

REFERENCES:
patent: 4440823 (1984-04-01), Hoffmann
patent: 4770921 (1988-09-01), Wacker et al.

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