Method for particulate-free energy beam cutting of a wafer of di

Details Method for particulate-free energy beam cutting of a wafer of di Method for particulate-free energy beam cutting of a wafer of di

1995-10-25

1997-06-24

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

438 20, 438463, B23K 2608

Patent

active

056414161

ABSTRACT:
A process for separating FED baseplates or other types of die assemblies from one another without producing any particulate matter or slag that could damage some of the baseplates. In one embodiment a high energy beam is aligned with a cutting line on the wafer that defines a path between the die assemblies along which the wafer is to be cut. At least one of the high energy beam or the wafer is moved in the direction of the cutting line so that the high energy beam passes over the wafer and penetrates the wafer to an intermediate depth along the length of the cutting line. The moving step is then repeated after each pass of the high energy beam over the wafer until the wafer is severed along the cutting path.

REFERENCES:
patent: 3629545 (1971-12-01), Graham
patent: 3970819 (1976-07-01), Gates et al.
patent: 3991296 (1976-11-01), Kojima et al.
patent: 4046985 (1977-09-01), Gates
patent: 4224101 (1980-09-01), Tijburg et al.
patent: 4543464 (1985-09-01), Takeuchi
patent: 5151135 (1992-09-01), Magee et al.

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