Method of clamping a circuit package to enhance heat transfer

Details Method of clamping a circuit package to enhance heat transfer Method of clamping a circuit package to enhance heat transfer

1982-03-26

1984-05-22

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

51137, 51138, 174 16HS, 174 52P, 357 81, 361386, 361395, H01B 1900

Patent

active

044492928

ABSTRACT:
The compact circuit package (11) includes an insulating housing (12) providing a circuit retaining cavity (19) substantially surrounded by a pair of spaced side walls (15, 16) each terminating at a first rim (21, 22) and a second pair of spaced side walls (17, 18) each terminating at a second rim (24, 25). Each of the side walls provides an abutment (28, 31, 34) which limits the depth of entry of an electrically insulating, heat conducting substrate (30) into the cavity (19). Outer portions (44, 45) of a first pair of side wall rims (21, 22) are removed such as by a sander (46) to form a clamping surface (48) which includes an outer surface (42) of substrate (30) and reduced end portions (49, 50) of the pair of the side wall rims (21, 22) to permit increased substantial clamping pressures to a substantially planar external heat dissipating object (51) without damaging the substrate (30) and the side walls (15, 16, 17, 18).

REFERENCES:
patent: 3271909 (1966-09-01), Rutt et al.
patent: 3543443 (1970-12-01), Heesemann
patent: 3958075 (1976-05-01), Kaufman
patent: 4106052 (1978-08-01), Schierz
patent: 4172272 (1979-10-01), Schneider
patent: 4196411 (1980-04-01), Kaufman
patent: 4218724 (1980-08-01), Kaufman
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4343113 (1982-08-01), Van Der Linden
patent: 4404739 (1983-09-01), Kiley et al.

Affiliated with

Also associated with

Rating

Method of clamping a circuit package to enhance heat transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of clamping a circuit package to enhance heat transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of clamping a circuit package to enhance heat transfer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1471761