Semiconductor module for microprocessor

Details Semiconductor module for microprocessor Semiconductor module for microprocessor

1997-10-29

1998-06-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257713, 257722, 361704, 361707, H05K 720

Patent

active

057610444

ABSTRACT:
A semiconductor package includes a microprocessor semiconductor device housed in a recess which is defined in a surface of a plastic grid array package which supports terminals that are to be connected to a wiring board when the semiconductor package is mounted on the wiring board. A plurality of cache memories each comprising a ball grid array package are mounted on a surface of the plastic grid array package which is opposite to the surface on which the terminals are supported. A heat sink is mounted in a region of the plastic grid array package which corresponds to the recess.

REFERENCES:
patent: 4860165 (1989-08-01), Cassinelli
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5297006 (1994-03-01), Mizakoshi
patent: 5367193 (1994-11-01), Malladi
patent: 5404273 (1995-04-01), Akagawa
patent: 5557502 (1996-09-01), Banerjee et al.
Research Disclosure "Thermal Hinged Heat Sink", Apr. 1988, No. 288, p. 361/304.

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