Silver spot/palladium plate lead frame finish

Details Silver spot/palladium plate lead frame finish Silver spot/palladium plate lead frame finish

1992-06-04

1995-01-24

Beck, Shrive

Coating processes

Electrical product produced

Metal coating

427123, C23C 2600

Patent

active

053841557

ABSTRACT:
The invention is to a method of spot plating parts of a plated semiconductor lead frame. The entire lead frame is first plated. Then parts of the lead frame, internal to the subsequent encapsulating package, are spot plated prior to encapsulating the semiconductor device. A spot of silver is plated in the mount and/or bond area of the lead frame.

REFERENCES:
patent: 4800178 (1989-01-01), Mathew
patent: 5138431 (1992-08-01), Huang
patent: 5146312 (1992-09-01), Lim

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