Sputtering apparatus

Details Sputtering apparatus Sputtering apparatus

1993-08-10

1995-01-24

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429807, 20429811, 20429828, C23C 1434

Patent

active

053840216

ABSTRACT:
Apparatus for sputtering coatings of material onto a substrate from a chamber subject to substantial evacuation during use, which includes: a substantially cylindrical target tube having on a surface thereof the material to be sputtered, means for rotating the target tube about its longitudinal axis, magnetic means for assisting the sputtering process by the provision of a magnetic field in a sputtering zone associated with the target tube, means for moving the substrate through the chamber and into the sputtering zone, means for introducing an ionisable gas and a reactive gas into the chamber in the vicinity of the sputtering zone, wherein supplementary magnetic means are provided to form a supplementary magnetic field remote from the sputtering zone and means are provided to introduce ionisable gas in the vicinity of the supplementary magnetic field.

REFERENCES:
patent: 4526643 (1985-07-01), Okano et al.
patent: 4631106 (1986-12-01), Nakazato et al.
patent: 4657619 (1987-04-01), O'Donnell
patent: 5047131 (1991-09-01), Wolfe et al.
"Design Advances and Applications of the Rotatable Cylindrical Magnetron"; Wright and Beardow; J. Vac. Sci. Technol. A4 (3), May/Jun. 1986; pp. 388-392.

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