Semiconductor chip mounting method and apparatus

Details Semiconductor chip mounting method and apparatus Semiconductor chip mounting method and apparatus

1994-03-03

1995-01-24

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156360, 356388, 356390, 356395, 356398, 356399, 437 7, 437 8, 437209, H01L 2160

Patent

active

053840003

ABSTRACT:
The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).

REFERENCES:
patent: 3684384 (1972-08-01), Hojo et al.
patent: 4833621 (1989-05-01), Umatate
patent: 4902631 (1990-02-01), Downey et al.
patent: 5262355 (1993-11-01), Nishiguchi et al.
Heng et al., Cooling MCMs With Pin Fin Heat Sinks, Electronic Packaging and Production, Oct. 1991, pp. 54-57.
Zimmerman, Protecting Multichip Modules With Molded Packaging, Electronic Packaging & Production, Oct., 1991, pp. 48-51.
Markstein, Multichip Modules Pursue Wafer Scale Performance, Electronic Packaging & Production, Oct., 1991, pp. 40-45.

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