Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-03-19
1999-11-09
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257667, 257787, 361813, H05K 702, H01L 2328
Patent
active
059826258
ABSTRACT:
A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.
REFERENCES:
patent: 5635671 (1997-06-01), Freyman et al.
patent: 5708300 (1998-01-01), Woosley et al.
patent: 5780933 (1998-07-01), Ohmori et al.
patent: 5859475 (1999-01-01), Freyman et al.
patent: 5886398 (1999-03-01), Low et al.
Chen Kun-Ching
Chen Tao-Yu
Huang Chun-Hsiung
Lee Chun-Che
Wang Wu-Chang
Advanced Semiconductor Engineering Inc.
Sparks Donald
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