Module for packaged IC

Details Module for packaged IC Module for packaged IC

1996-01-23

1999-11-09

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 174 522, 361773, H05K 720

Patent

active

059826231

ABSTRACT:
A module is provided for a packaged IC designed to radiate heat by sealing the packaged IC. At least outer lead parts the packaged IC which are mounted on an electronic circuit board are sealed by a sealing material of a high thermal conductivity to form a sealing part.

REFERENCES:
patent: 4326238 (1982-04-01), Takeda
patent: 4529755 (1985-07-01), Nishikawa
patent: 4769344 (1988-09-01), Sakai
patent: 4933744 (1990-06-01), Segawa
patent: 4965699 (1990-10-01), Jorden
patent: 4974119 (1990-11-01), Martin
patent: 5043211 (1991-08-01), Yoshizumi
patent: 5313365 (1994-05-01), Pennisi
patent: 5371404 (1994-12-01), Jusjey
patent: 5399416 (1995-03-01), Butard
patent: 5469333 (1995-11-01), Ellerson
patent: 5572070 (1996-11-01), Ross

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