Solder bonding printed circuit boards

Details Solder bonding printed circuit boards Solder bonding printed circuit boards

1998-03-12

2000-01-11

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

H01R 909

Patent

active

060138777

ABSTRACT:
The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.

REFERENCES:
patent: 5061548 (1991-10-01), Arthur et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5640052 (1997-06-01), Tsukamoto
patent: 5761051 (1998-06-01), Tran
patent: 5764485 (1998-06-01), Lebaschi
patent: 5796038 (1998-08-01), Manteghi
patent: 5865365 (1999-02-01), Nishikawa et al.

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