In situ method for forming a capacitive PCB

Details In situ method for forming a capacitive PCB In situ method for forming a capacitive PCB

1992-04-06

1993-11-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156902, 361761, 428901, H05K 336

Patent

active

052611531

ABSTRACT:
An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB.

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