Metal treatment – Compositions – Fluxing
Patent
1982-11-24
1984-12-11
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
148 23, B23K 3534
Patent
active
044876386
ABSTRACT:
A method of attaching semiconductor die to a package substrate and a composition for such die attach is disclosed, which method and composition comprise the combination of a low and a high-melting powder with a vehicle consisting of a solvent and a binder so as to form a thick-film ink. The ink is deposited onto the package substrate and the semiconductor die with a metallized back surface is located in contact with the deposited ink. The package containing the ink and the die is heated to a temperature of approximately 160.degree. C. so as to remove the solvent from the powders and the residual binder. Next, the package is fired at a temperature within the range of approximately 200.degree. C. to 430.degree. C. so as to melt the low-melting powder which bonds the chip to the package substrate. Then, a lid is sealed over the die-receiving cavity of the package by heating the package and the bonded die to a temperature within a range of approximately 400.degree. C. to 450.degree. C. wherein the low-melting powder remelts and the high-melting powder partially dissolves into the liquid of the remelted low-melting powder.
REFERENCES:
patent: 2547771 (1951-04-01), Pessel
Burroughs Corporation
Fassbender Charles J.
Peterson Kevin R.
Richbourg J. Ronald
Rosenberg Peter D.
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