Direct connect carrier for testing semiconductor dice and method

Details Direct connect carrier for testing semiconductor dice and method Direct connect carrier for testing semiconductor dice and method

1996-07-01

1999-11-09

Brock, Michael

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324537, 324754, 324755, 324555, 3241581, 324765, G01R 3102

Patent

active

059821850

ABSTRACT:
A carrier and system for testing a semiconductor die and a method for fabricating the carrier are provided. The carrier comprises a base and an interconnect attached to the base adapted to establish temporary electrical communication with the die. The interconnect includes contact members adapted to make temporary electrical connections with test pads on the die. In addition, the interconnect includes conductors in electrical communication with the contact members. The conductors include input/output pads configured for direct electrical connection to an electrical connector of a testing apparatus such as socket on a burn-in board. In a first embodiment of the interconnect, the contact members are formed on a silicon substrate and include penetrating projections. In an alternate embodiment of the interconnect, the contact members are formed as microbumps mounted on flexible tape. The contact members and conductors can be formed as a single layer of material or as a bi-metal stack including a conductive layer formed of a highly conductive metal such as aluminum, and a contact layer formed of an inert wear resistant metal such as palladium, tungsten or platinum.

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