Test head for integrated circuits

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324757, 324758, G01R 3102

Patent

active

059821841

ABSTRACT:
A test head is used in an electrical characteristic test of a plurality of integrated circuits formed on a semiconductor wafer. The test head includes a probe holder in a frame form for holding a plurality of first probes and supporting bodies in a plate form for supporting a plurality of second probes. The probe holder is disposed on a base plate such that the first probes are brought into contact with pads disposed at a portion corresponding to the edge portion defining an opening formed in the base plate. The supporting bodies are attached to the base plate with the direction of their thickness oriented in the lengthwise direction of the opening in the base plate in order that the second probes are brought into contact with pads existing at the boundary portions of a plurality of integrated circuits to be tested at a time and disposed at the portions corresponding to the adjoining sides of the integrated circuits.

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