Metallized multilayer packaging film

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428209, 428409, 428213, 428461, 428515, 428516, 428522, B32B 1508

Patent

active

060133538

ABSTRACT:
A metallized multilayer film comprising a film substrate having a polymer core layer, e.g., a polypropylene homopolymer (OPP), on at least one surface of which is a polymer skin layer having a lower melting temperature than that of said core layer, the exposed surface of skin layer having been treated, e.g., flame or corona discharge treated, prior to coating to increase its adherence to other materials, the film substrate containing a metal deposit, e.g., aluminum, coated on the treated surface of the polymer skin layers, and a polymeric, low temperature sealable coating (LTSC) comprising a copolymer of about 10 to 35 wt. % of at least one .alpha.,.beta.-ethylenically unsaturated carboxylic acid, e.g., acrylic or methacrylic acid, with about 65 to 90 wt. % of ethylene, an alkyl acrylate or methacrylate, acrylonitrile, or mixtures thereof on the surface of the metal deposit. Optionally, the polymer substrate may contain another polymer skin layer on the other side of the core layer, another coating may be deposited on the surface of the film opposite that containing the metal deposit, and/or a printed ink pattern and overlacquer may be applied to the surface of the LTSC on the metal deposit or the coated or uncoated opposite surface of the film substrate. The film has excellent mechanical and barrier properties and can be used to overwrap food and non-food products such that the package has a protected metal layer and good seal strength.

REFERENCES:
patent: 3753769 (1973-08-01), Steiner
patent: 4345005 (1982-08-01), All et al.
patent: 4692380 (1987-09-01), Reid
patent: 4695503 (1987-09-01), Liu et al.
patent: 4749616 (1988-06-01), Liu et al.
patent: 4865908 (1989-09-01), Liu et al.
patent: 5126198 (1992-06-01), Schinkel et al.
patent: 5419960 (1995-05-01), Touhsaeut
patent: 5827615 (1998-10-01), Touhsaent et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metallized multilayer packaging film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallized multilayer packaging film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallized multilayer packaging film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1460493

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.