Method for forming lead frame for integrated circuit devices

Details Method for forming lead frame for integrated circuit devices Method for forming lead frame for integrated circuit devices

1983-06-22

1984-12-11

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

H01R 4300

Patent

active

044869487

ABSTRACT:
A lead frame for an IC device includes a body element located at its center, the body element including recesses in its outer periphery in which the inner tips of the leads of the lead frame are fitted at predetermined positions. With such an arrangement, the leads are prevented from being deformed during steps of formation of the IC device.

REFERENCES:
patent: 3832480 (1974-08-01), Bunker
patent: 4012835 (1977-03-01), Wallick

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